Handōtai, Shuseki-Kairo-Gijutsu-72.-Shinpojiumu-kōen-ronbunshū Tōkyō, July 10 - 11, 2008

Literaturangaben

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Bibliographische Detailangaben
Körperschaft: Denki-Kagakkai Denshi-Zairyō-Iinkai (BerichterstatterIn)
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: Tōkyō 2008
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Konferenzschrift > Japan > Halbleiterschaltung > Integrierte Schaltung
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Titel Jahr Verfasser
Highly Reliable Ultra-thin Barrier Metal using Cu-Mn Alloy 2008 Shimizu, N.
Enhancing Yield and Reliability by Applying Dry Organic Acid Vapor Cleaning to Copper Contact Via-bottom for 32-nm nodes and Beyond 2008 Ishikawa, K.
3-D Packaging Technology using Through-Si-Via 2008 Mitsuhashi, T.
Characteristics Variation in Scaled MOSFETs 2008 Hiramato, T.
R & D Trend and Problems of LSI Multilevel Interconnect Technology 2008 Matsunaga, N.
How to Realize a Robust Porous Low-k Film ovy Cost-effective Process ? 2008 Hayashi, Y.
Nanoimprint Lithography for CMOS Application 2008 Wada, H.
Cu Electroplating for Through Silicon Via 2008 Fukunaga, A.
Automotive Sensors with MEMS Technology and Their Expansion 2008 Nonomura, Y.
Feasibility of Si Interfacial Layer Insertion for La2O3/Ge MOS Device 2008 Kakushima, K.
The Study of Reduction in Etching-rate of SiOC Film and Improvement of Etching-stop in Via-etching 2008 Momonoi, Y.
PEALD RuTa Composite Film as a Seed Layer for CVD Cu Filling 2008 Jeong, D.
Automotive Semiconductor Technologies and Requests from Car Makers 2008 Hattori, M.
Gate-first Metal Gate/Dual High-k CMOS with Low Threshold Voltages 2008 Nara, Y.
EMC Measures and Highly Reliable Technology Built into Advanced Automotive MCUs 2008 Kudo, T.
Mechanisms of Effective Work Function Modulation of Metal/Hf-based High-k Gate Stacks 2008 Watanabe, H.
Comparison of Chemical Binding States Between Ultra Shallow Plasma Doping(PD) and Ion Implantation(I/I) Samples by using Hard X-ray Photoelectron Spectroscopy(HX-PES) 2008 Jin, C. G.
A Study of the Electrical Resistivity Increase in Narrow and Thin Copper Interconnects 2008 Wada, M.
Highly Reliable Low Resistance Cu Contact using Novel CVD Ru/TiN/Ti Stacked Liner 2008 Kitamura, M.
Extension of IMAPCAR(Parallel Processor for Image Recognition) to Automotive Field 2008 Hidano, F.
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