IPACK2022-97218 Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

IPACK2022-97218 Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022)
1. Verfasser: Min, Daeho (VerfasserIn)
Weitere Verfasser: Han, Minsoo (VerfasserIn), Kim, Juno (VerfasserIn), Lee, Kangsan (VerfasserIn), Lim, Kyeongbin (VerfasserIn), Choi, Euisun (VerfasserIn), Seok, Seung (VerfasserIn), Lee, Byeongjun (VerfasserIn), Rhee, Minwoo Daniel (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
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