IPACK2022-96751 Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

IPACK2022-96751 Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022)
1. Verfasser: Knox, Carlton (VerfasserIn)
Weitere Verfasser: Yuan, Zihao (VerfasserIn), Coskun, Ayse K. (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
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