A 0.5V, 200MHz 32b ALU using a Body Bias Controlled SOI Pass-gate-logic

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (52 : 1997 : Osaka) 52. Handōtai Shuseki Kairo Gijutsu Shinpojiumu Kōen Ronbunshū
1. Verfasser: Watanabe, S. (VerfasserIn)
Weitere Verfasser: Fuse, T. (VerfasserIn), Yamada, T. (VerfasserIn), Kamoshida, M. (VerfasserIn), Ohta, M. (VerfasserIn), Shino, T. (VerfasserIn), Kawanaka, S. (VerfasserIn), Terauchi, M. (VerfasserIn), Yoshida, T. (VerfasserIn), Matsubara, G. (VerfasserIn), Yoshioka, S. (VerfasserIn), Yoshimi, M. (VerfasserIn), Ohuchi, K. (VerfasserIn), Manabe, S. (VerfasserIn)
Pages:52
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 1997
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Porous SOG for Intermetal Dielectrics 1997 Aoi, N.
Evaluation of the Low Dielectric Fluorinated Carbon Film for Use As the Interlayer Dielectric in ULSI Devices 1997 Hasegawa, T.
Two Approaches to the Development of Low k Systems; Parylene AF-4, and Fluorinated Amorphous Carbon 1997 Harrus, A.
Delamination of Thin Si and SiC Layers by The H*implantation 1997 Hara, T.
A 0.5V, 200MHz 32b ALU using a Body Bias Controlled SOI Pass-gate-logic 1997 Watanabe, S.
Investigation of F2 Reaction Process on Si(111) Surface by Molecular Orbital Method 1997 Kanashima, T.
High Aspect Ratio ULSI Etching Technology 1997 Horiike, Y.
Fabrication Technology of Ferroelectric Memory by Using Ir System Materials as Electrodes 1997 Izumi, N.
Formation of Metal-Ferroelectric-Insulator Semiconductor Structure for Single Transistor Memory 1997 Kim, T.-Y.
Plasma Immersion Ion Implantation for Shallow Junctions and Other Applications 1997 Shao, J.
High Performance Multilevel Interconnects Featured by Cu-dual-damascene in Low k, Organic Films 1997 Hayashi, Y.
Production Etching of Dielectrics and Metals for High Density Ferroelectric FeRAM and DRAM Applications 1997 Hambalek, S.
Dielectric Planarization using Mn2O3 Slurry 1997 Kishii, S.
Integration of Copper Metallization with Bulk and SIMOX CMOS Device Technology 1997 Evans, D. R.
Electromigration in W Plug, Al Filled, and Cu Filled Vias 1997 Kawasaki, H.
Current Issues and Prospects of Low-k Film Deposition Technology by HDP-CVD 1997 Tribura, D.
Process Integration of SrBi2Ta2O9 Ferroelectric Capacitors 1997 Judai, Y.
Plasma Doping 1997 Mizuno, B.
Development of the Ion Source for Ultra-Shallow Junction Ion Implantation System 1997 Sakai, S.
Key Issues and Advances in CMP Technology for Inter-Level Dielectrics 1997 Jairath, R.
Alle Artikel auflisten