IPACK2018-8358 Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

IPACK2018-8358 Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018
1. Verfasser: Lall, Pradeep (VerfasserIn)
Weitere Verfasser: Deshpande, Shantanu (VerfasserIn), Nguyen, Luu (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
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