Cu balls and Cu-core balls for 3D packaging

Cu balls and Cu-core balls for 3D packaging

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan)
1. Verfasser: Kawasaki, Hiroyoshi (VerfasserIn)
Weitere Verfasser: Hattori, Takahiro (VerfasserIn), Roppongi, Takahiro (VerfasserIn), Soma, Daisuke (VerfasserIn), Sato, Isamu (VerfasserIn), Kawamata, Yuji (VerfasserIn)
Pages:2013
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2013
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Bridging Between 3D Stacking and 3D IC Technologies 2013 Zohni, Wael
Perspective for Advanced Micro-solder Bump Bonding 2013 Orii, Yasumitsu
Thermal Via Technology for Silica-based Planar Lightwave Circuit 2013 Aozasa, Shinichi
Hybrid integration technology of laser source with laser diode arrays on silicon optical waveguide platform by flip-chip bonding for silicon photonics 2013 Shimizu, Takanori
Noise Suppression by Lossy Filters in Power Distribution Network 2013 Toyota, Yoshitaka
Power distribution network design method based on frequency-dependent target impedance for jitter design of memory interface 2013 Ikeda, Yasuhiro
Growth models of copper filling in through silicon via at different current density 2013 Wang, Zhaoyu
High Bandwidth Application with Wide I/O Memory on 2.5DIC Silicon Interposer 2013 Wang, Chen-Chao
Demonstration of high-bandwidth density and low-power organic optical MCM link 2013 Tokunari, Masao
Optical Multi-channel Connector for Rigid Waveguide and Fiber Connection 2013 Nakazuru, Kazumi
High-speed KTN optical beam deflector for swept-source optical coherence tomography 2013 Sasaki, Yuzo
Novel Bonding Method Using Cu Bumps Coated With Flexible Ag Nanoparticle Layer Formed By Squeegee-Coating 2013 Fu, Weixin
Mechanical Properties of Sn-58Bi, In-3Ag and SAC305 Solders Measured with Fine Diameter Specimens 2013 Hisada, Takashi
VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure 2013 Shigetou, Akitsu
Metal-filled anodized aluminum oxide: A potential substrate material for a high density interconnection in 3D packaging 2013 Hotta, Yoshinori
Microstructural Control of Electrically Cnductive Adhesives with Ag micro-fillers by Binder Chemistry 2013 Inoue, Masahiro
Improvement of chemical resistance of positive-tone photosensitive polyimide coatings in the electroless plating process 2013 Baba, Osamu
Low Profile Cooling Solutions for Advanced Packaging Based on Ultra-Thin Heat Pipe and Piezo Fan 2013 Singh, Randeep
Failure analysis of electric circuit board by high resolution magnetic field microscopy 2013 Mima, Yuki
Nondestructive defect analysis case example using combination of Lock-in IR Thermography and high resolution X-ray CT technology 2013 Seimiya, Naoki
Alle Artikel auflisten