IPACK2020-2676 Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

IPACK2020-2676 Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Lall, Pradeep (VerfasserIn)
Weitere Verfasser: Choudhury, Padmanava (VerfasserIn), Williamson, Jaimal (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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