Integrating Hf-based high-k gate stacks with polysilicon gates

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Handōtai-Shūseki-Kairo-Gijutsu-Shinpojiumu (64 : 2003 : Osaka) Handōtai, Shuseki-Kairo-Gijutsu-64.-Shinpojiumu-kōen-ronbunshū
1. Verfasser: Gendt, S. De (VerfasserIn)
Weitere Verfasser: Chen, J. (VerfasserIn), Kaushik, V. (VerfasserIn), Claes, M. (VerfasserIn), Witters, T. (VerfasserIn), Rohr, E. (VerfasserIn), Carter, R. (VerfasserIn), Kubicek, S. (VerfasserIn), Tsai, W. (VerfasserIn), Ragnarsson, L. (VerfasserIn), Conard, T. (VerfasserIn), Pantisano, L. (VerfasserIn), Elshocht, S. Van (VerfasserIn), Delabie, A. (VerfasserIn), Schram, T. (VerfasserIn), Caymax, M. (VerfasserIn), Heyns, M. (VerfasserIn)
Pages:64
Format: UnknownFormat
Sprache:jpn
Veröffentlicht: 2003
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
The emerging new memories: their characteristics and applications 2003 Jeong, H.
Non-Volatile Logic with Ferroelectric Technology 2003 Nakamura, T.
Reliability Improvement of 90nm-node Cu/Low-k Interconnect 2003 Hashimoto, K.
Integrating Hf-based high-k gate stacks with polysilicon gates 2003 Gendt, S. De
Correlation between microstructure and reliability of Cu interconnects 2003 Moriyama, M.
MONOS Nonvolatile Semiconductor Memory Technology 2003 Minami, S.
Current Status of Low-k Materials and Processes toward 65 nm Node Intetconnect Technology 2003 Kobayashi, N.
Stress Engineering of Multi-Level Interconnection Module with Copper and Low-k Dielectric 2003 Hasunuma, M.
Low Dielectric Porous Diamond Film Composed of Diamond Nano-particles 2003 Sakaue, H.
Mechanism of Mobility Reduction for MISFETs with high-k gate dielectrics 2003 Saito, S.
Electrical properties of HfO2 films prepared by remote plasma oxidation of Hf metal 2003 Yamamoto, K.
Ferroelectric Properties of BiFeOs Thin Films prepared by Chemical Solution Deposition and Pulsed Laser Deposition Method 2003 Yun, K. Y.
Flash CVD Technology 2003 Shoji, M.
ESR study of silicon nitride film used in MONOS nonvolatile semiconductor memory 2003 Shishido, Y.
Thick Oxide Layer Fabrication Process for Silicon RF ICs 2003 Tsuruta, K.
Molecular Design and Syntheses of Ultra Tough Organic Low-k Dielectrics 2003 Aoi, N.
Electroles Plating of Cu Without Pd Catalysis For Fine Cu Interconnect Formation 2003 Shingubara, S.
WIWNU Improvement of Electro chemical Cu plating on thin seed layer 2003 Suzuki, H.
Growth of Cu and Ta films by metal chloride reduction CVD 2003 Sakamoto, H.
Reliability in Copper interconnects with SiLK interlevel dielectrics 2003 Sato, M.
Alle Artikel auflisten