IPACK2018-8447 Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

IPACK2018-8447 Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018
1. Verfasser: Zhou, Kan (VerfasserIn)
Weitere Verfasser: Li, Junye (VerfasserIn), Feng, Zhao-zan (VerfasserIn), Li, Wei (VerfasserIn), Zhu, Hua (VerfasserIn), Sheng, Kuang (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
IPACK2018-8212 Effect of Interfacial Thermal Conductance Between the Nanoparticles 2019 Yuksel, Anil
IPACK2018-8257 Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP 2019 Wang, Huayan
IPACK2018-8378 A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers 2019 Varadharasan, Mullaivendhan
IPACK2018-8432 Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time 2019 Bansode, Pratik V.
IPACK2018-8256 Analysis of Thermal Properties of Power Multifinger HEMT Devices 2019 Chvála, Aleš
IPACK2018-8276 Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration 2019 Paret, Paul
IPACK2018-8307 Thermal Interface Materials Enhanced by Micro and Nanostructures 2019 Lu, Mei-Chien
IPACK2018-8315 Molecular Dynamics Simulation of AIN Deposition: Effect of N:AI Flux Ratio 2019 Zhang, Libin
IPACK2018-8355 Multifunctional Chip for Use in Thermal Analysis of Power Systems 2019 Gonzalez-Nino, David
IPACK2018-8383 Orientation Effects in Two-Phase Microgap Flow 2019 Robinson, Franklin L.
IPACK2018-8449 Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes 2019 Shen, Kunrong
IPACK2018-8454 Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes 2019 Li, Wei
IPACK2018-8358 Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments 2019 Lall, Pradeep
IPACK2018-8386 Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems 2019 Brinkfeldt, Klas
IPACK2018-8294 Lidded vs. Lidless: A Thermal Study 2019 Huang, Xiaopeng
IPACK2018-8301 Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs Silica-on-Chip Structure 2019 Xie, Bin
IPACK2018-8337 On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties 2019 Chowdhury, Piyas
IPACK2018-8254 Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging 2019 Thanu, Dinesh P. R.
IPACK2018-8338 Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions 2019 Serebreni, Maxim
IPACK2018-8436 Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization 2019 Thirunavakkarasu, Gautham
Alle Artikel auflisten