IPACK2019-6568 Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages

IPACK2019-6568 Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB's and Reliability of Electronic Packages

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019
1. Verfasser: Ramdas, Shrinath (VerfasserIn)
Weitere Verfasser: Rajmane, Pavan (VerfasserIn), Chauhan, Tushar (VerfasserIn), Misrak, Abel (VerfasserIn), Agonafer, Dereje (VerfasserIn)
Pages:2019
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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