Influence of Diffusion on Solid-state Bonding for Micro-bumps at Low Temperatures

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Veröffentlicht in:2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan)
1. Verfasser: Wang, Ying-Hui (VerfasserIn)
Weitere Verfasser: Suga, Tadatomo (VerfasserIn)
Pages:2013
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2013
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