High Cleanliness and High Hydrophobic/Hydrophilic Contrast Done by Direct Wafer Bonding for Die-to-Wafer Self-Assembly

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Bibliographische Detailangaben
Veröffentlicht in:	International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17
1. Verfasser:	Montméat, P. (VerfasserIn)
Weitere Verfasser:	Enot, T. (VerfasserIn), Bond, A. (VerfasserIn), Thiolon, A. (VerfasserIn), Bourjot, E. (VerfasserIn), Fournel, F. (VerfasserIn)
Pages:	17
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2023
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