Preferred Grain Orientation to Enhance Interdiffusion at Room Temperature in Atomic Diffusion Bonding: A Fundamental Study Using Ni and Cu Films

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Veröffentlicht in:	International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications (17. : 2023 : Göteborg) Semiconductor Wafer Bonding: Science, Technology and Applications 17
1. Verfasser:	Uomoto, M. (VerfasserIn)
Weitere Verfasser:	Kikuchi, S. (VerfasserIn), Goto, F. (VerfasserIn), Shimatsu, T. (VerfasserIn)
Pages:	17
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2023
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