| Data Centers, Servers of the Future, Edge and Cloud Computing IPACK2021-66660 Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
|
2021 |
Zhuang, Ming-Han |
| IPACK2021-73954 Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages
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2021 |
Sahan,, Arunima Panigrahy, Prabhakar Subrahmanyam, Ying-Feng Pang, Ridvan |
| IPACK2021-74016 Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
|
2021 |
May, Chris |
| IPACK2021-74088 Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing
|
2021 |
Lall, Pradeep |
| IPACK2021-74570 Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
|
2021 |
Lall, Pradeep |
| IPACK2021-72726 Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
|
2021 |
Carlton, Hayden |
| IPACK2021-69321 Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics
|
2021 |
Olivera, Adrian |
| IPACK2021-69751 A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles
|
2021 |
Choi, Nicholas |
| IPACK2021-73100 Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
|
2021 |
Maniar, Youssef |
| IPACK2021-72293 Reliability of Electronic Drivers: An Industrial Approach
|
2021 |
Watté, P. |
| IPACK2021-69719 Mechanical Behavior of Heat Activated Film Adhesives
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2021 |
Janamanchi, Prabhat |
| IPACK2021-74044 Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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2021 |
Hasan, S. M. Kamrul |
| IPACK2021-69317 Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling
|
2021 |
Chowdhury, Tanvir Ahmed |
| IPACK2021-69495 Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
|
2021 |
Avanessian, Tadeh |
| Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics
|
2021 |
Lu, Mei-Chien |
| IPACK2021-73015 Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
|
2021 |
Arrivo, Lucas |
| IPACK2021-74108 Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
|
2021 |
Nordlund, Alec |
| IPACK2021-68902 Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading
|
2021 |
Horiuchi, Ryota |
| IPACK2021-74071 Additively Printed Flexible Temperature Sensor for Wearable Applications
|
2021 |
Lall, Pradeep |
| IPACK2021-74073 Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
|
2021 |
Lall, Pradeep |
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