IPACK2021-73283 Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

IPACK2021-73283 Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
1. Verfasser: Kisitu, Deogratius (VerfasserIn)
Weitere Verfasser: Ortega, Alfonso (VerfasserIn)
Pages:2021
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
IPACK2021-69495 Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy 2021 Avanessian, Tadeh
Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics 2021 Lu, Mei-Chien
IPACK2021-73015 Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers 2021 Arrivo, Lucas
IPACK2021-74108 Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing 2021 Nordlund, Alec
IPACK2021-68902 Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading 2021 Horiuchi, Ryota
IPACK2021-74071 Additively Printed Flexible Temperature Sensor for Wearable Applications 2021 Lall, Pradeep
IPACK2021-74073 Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment 2021 Lall, Pradeep
IPACK2021-69270 Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics 2021 Guerrero, Margie
IPACK2021-73252 Transient Performance and Melt Front Characterization of Phase Change Materials 2021 Stamps, Tyler
IPACK2021-74010 Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells 2021 Varghese, Dinumol
IPACK2021-70410 Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam 2021 Kawakita, Shinya
IPACK2021-73319 Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading 2021 Kuczynska, Marta
IPACK2021-72976 CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and De- terioration of Supply Flow Rate 2021 Fukuda, Tetsushi
IPACK2021-73287 Characterization of High-Density Aircraft Electronic and Thermal Management Systems 2021 Kasitz, Joshua
IPACK2021-73348 Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints 2021 Haq, Mohammad Ashraful
IPACK2021-74062 Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation 2021 Lall, Pradeep
IPACK2021-74068 Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage 2021 Lall, Pradeep
IPACK2021-74199 Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL) 2021 Lee, S. W. R.
IPACK2021-69254 Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material 2021 Bharadwaj, Bharath
IPACK2021-66842 Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements 2021 Warzoha, Ronald J.
Alle Artikel auflisten