IPACK2022-97253 A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

IPACK2022-97253 A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022)
1. Verfasser: Deo, Karthik Arun (VerfasserIn)
Weitere Verfasser: Kono, Raymond-Noel (VerfasserIn), Cai, Chongyang (VerfasserIn), Yang, Junbo (VerfasserIn), Lai, Yangyang (VerfasserIn), Park, Seungbae (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
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