IPACK2022-93878 Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

IPACK2022-93878 Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022)
1. Verfasser: Mazumder, Golam Rakib (VerfasserIn)
Weitere Verfasser: Haq, Mohammad Ashraful (VerfasserIn), Suhling, Jeffrey C. (VerfasserIn), Lall, Pradeep (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
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