IPACK2022-97431 ANN Based Assessment of State-of-Health Reliability of Flexible Li-lon Batteries Under Dynam- ic Flexing and Calendar Aging

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022 : Garden Grove, Calif.) Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2022)
1. Verfasser: Lall, Pradeep (VerfasserIn)
Weitere Verfasser: Jang, Hyesoo (VerfasserIn)
Pages:2022
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
IPACK2022-97047 Direct-to--ChipTwo-Phase Cooling for High Heat Flux Processors 2022 Heydari, Ali
IPACK2022-97386 Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers 2022 Heydari, Ali
IPACK2022-97402 CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server 2022 Murthy, Prajwal
IPACK2022-97443 Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level 2022 Modi, Himanshu
IPACK2022-97729 Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling 2022 Cataldo, Filippo
IPACK2022-97186 AV/ML Applications for Thermally Aware SoC Designs 2022 Norman, Adam
IPACK2022-97363 Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods 2022 Leslie, David
IPACK2022-97430 Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components 2022 Lall, Pradeep
IPACK2022-97457 Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability 2022 Lall, Pradeep
IPACK2022-97399 Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability 2022 Kasitz, Joshua
IPACK2022-98066 Topology Optimization of Heat Sink for 3D Integrated Power Converters 2022 Xu, Xiaogiang
IPACK2022-93878 Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder 2022 Mazumder, Golam Rakib
IPACK2022-97175 RoHS - Compliant Indirectly Material Evaluation for Manufacturing Study 2022 Liu, Fenny
IPACK2022-97349 Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods 2022 Lai, Yangyang
IPACK2022-97427 Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure 2022 Lall, Pradeep
IPACK2022-97438 High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C 2022 Lall, Pradeep
IPACK2022-97449 Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days 2022 Lall, Pradeep
IPACK2022-97614 Al-Based Reliability Assessment of Power Electronic Systems 2022 McCluskey, F. Patrick
IPACK2022-97425 Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment 2022 Heydari, Ali
IPACK2022-97434 A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads 2022 Heydari, Ali
Alle Artikel auflisten