IPACK2020-2547 High Performance Computing Package With Chip Module on Substrate Solutions

IPACK2020-2547 High Performance Computing Package With Chip Module on Substrate Solutions

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Chen, Ching Chia (VerfasserIn)
Weitere Verfasser: Lai, David (VerfasserIn), Lin, Vito (VerfasserIn), Wang, Yu Po (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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