IPACK2020-2542 Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

IPACK2020-2542 Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

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Bibliographische Detailangaben
Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Amalfi, Raffaele L. (VerfasserIn)
Weitere Verfasser: Salamon, Todd (VerfasserIn), Cataldo, Filippo (VerfasserIn), Marcinichen, Jackson B. (VerfasserIn), Thome, John R. (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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