IPACK2020-2614 PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

IPACK2020-2614 PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2020 : Online) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2020
1. Verfasser: Kaulfersch, A. Otto. E. (VerfasserIn)
Weitere Verfasser: Singh, P. (VerfasserIn), Romano, C. (VerfasserIn), Hildebrandt, M. (VerfasserIn), Rzepka, S. (VerfasserIn)
Pages:2020
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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