Failure Analysis on Inter Polysilicon Oxide Reliability Issues of 40nm Automotive NVM Device

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Veröffentlicht in:	International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019
1. Verfasser:	Tan, P. K. (VerfasserIn)
Weitere Verfasser:	Fransiscus, R. (VerfasserIn), Pan, Y. L. (VerfasserIn), Thoungh, H. H. W. (VerfasserIn), Ting, S. L. (VerfasserIn), Zhao, Y. Z. (VerfasserIn), Wee, T. L. (VerfasserIn), Tan, H. (VerfasserIn), Neo, S. P. (VerfasserIn), Chen, C. Q. (VerfasserIn)
Pages:	2019
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2019
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