IPACK2018-8414 Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

IPACK2018-8414 Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018
1. Verfasser: Chowdhury, Md Mahmudur R. (VerfasserIn)
Weitere Verfasser: Hoque, Mohd Aminul (VerfasserIn), Fahim, Abdullah (VerfasserIn), Suhling, Jeffrey C. (VerfasserIn), Hamasha, Sa'd (VerfasserIn), Lall, Pradeep (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
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