IPACK2018-8211 Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

IPACK2018-8211 Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018
1. Verfasser: Yu, Xingjian (VerfasserIn)
Weitere Verfasser: Hu, Run (VerfasserIn), Wu, Ruikang (VerfasserIn), Xie, Bin (VerfasserIn), Zhang, Xiaoyu (VerfasserIn), Luo, Xiaobing (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
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