IPACK2019-6560 Evolution of the Microstructure of Lead Free Solders Subjected to Bot Aging and Cyclic Loading

IPACK2019-6560 Evolution of the Microstructure of Lead Free Solders Subjected to Bot Aging and Cyclic Loading

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2019
1. Verfasser: Chowdhury, Md Mahmudur R. (VerfasserIn)
Weitere Verfasser: Hoque, Mohd Aminul (VerfasserIn), Suhling, Jeffrey C. (VerfasserIn), Hamasha, Sa'd (VerfasserIn), Lall, Pradeep (VerfasserIn)
Pages:2019
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2020
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