High-speed optical engines and optical interconnect challenges and solutions

High-speed optical engines and optical interconnect challenges and solutions

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:2013 IEEE CPMT Symposium Japan (formerly VLSI Packaging Workshop of Japan)
1. Verfasser: Fields, Mitch (VerfasserIn)
Pages:2013
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2013
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Design, Simulation, and Process Development of 2.5D TSV Interposer for High Density Packaging 2013 Shangguan, Dongkai
POP package for Mobile Application Processor 2013 Tonglong, Zhang
Heterogeneous integration for silicon photonics 2013 Fish, Greg
Ultra-wideband Noise Suppression of Power Supply Noise by Combining Mushroom and Planar Type EBG Structures 2013 Ikemiya, Keisuke
Power integrity behavior for various packaging environments 2013 Terasaki, Masahiro
Cu Pillar - the Next Phase in the Evolution of the Packaging DNA 2013 Chen, William T.
A numerical model for Bottom-up copper electrodeposition of TSV with additives 2013 Luo, Wei
No-Polish Elastic Optical Multifiber Connector for Optical Interconnection 2013 Aoki, Tsuyoshi
Bump & Ball Interconnect Technology Update 2013 Yoshida, Akito
Influence of Diffusion on Solid-state Bonding for Micro-bumps at Low Temperatures 2013 Wang, Ying-Hui
Thermal reliability of Ag-8Au-3Pd alloy wire bonds 2013 Guo, Rui
A Broadband Antenna with Fan-Shaped and Trapezoidal Elements on Printed Circuit Board for Ultra-Wideband Radio 2013 Koshiji, Fukuro
Applied Voltage Dependence of Hotspot Location and Temperature in Power Si MOSFET 2013 Kibushi, Risako
A Finite Element Analysis of Board Level Drop Reliability Test and Analysis of Stress Buffer Effect of Polyimide 2013 Fujita, Mitsuru
Reduction Method of Number of Electromagnetic Simulation Times for Estimationg Output Voltage at Hard Open TSV in 3D IC 2013 Haraguchi, Ei
A 77 GHz CMOS Power Amplifier Module Using Multi-layered redistribution Layer Technology 2013 Sato, Masaru
Airfoil: A New Fine Line Fabrication Technology on Glass-cloth Prepreg without Insulating Films for PKG Substrate 2013 Yamada, Kumpei
Fine pitch PoP Introduction 2013 Kim, Jinseong
High-speed optical engines and optical interconnect challenges and solutions 2013 Fields, Mitch
Polymer waveguide-coupled 14-Gb/s x 12-channel parallel-optical modules mounted on optical PCB through Sn-Ag-Cu solder reflow 2013 Rizky, Agyl Fajar
Alle Artikel auflisten