Thermal and Electric Conductive Analysis in Isotropical Conductive Adhesive by Modeling 3D Fillers Dispersion Observed by FIB-SEM

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Veröffentlicht in:2012 2nd IEEE CPMT Symposium Japan
1. Verfasser: Arao, Osamu (VerfasserIn)
Weitere Verfasser: Shintai, Akira (VerfasserIn), Sugiura, Akio (VerfasserIn)
Pages:2012 2
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Sprache:eng
Veröffentlicht: 2012
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