Productivity Improvement of Copper Pillar Flip-chip Package by Pre-applied Materials and Press Machine
|
2012 |
Motomura, Koji |
High Density Package Solutions for Next-Generation Smartphone, Ultrabook and Tablet Computing
|
2012 |
Solberg, Vern |
Novel DAF (Die Attach Film) separation technologies for ultra-thin chip
|
2012 |
Takyu, Shinya |
Thin Packaging - What is Next?
|
2012 |
Appelt, Bernd K. |
Electrical Properties of Flexible Vertically aligned Carbon Nanotube Bumps under Compression
|
2012 |
Fujino, Masahisa |
(Invited) Next Generation Optical Interconnect Devices Using Photonic Polymers
|
2012 |
Sugihara, Okihiro |
Cavity-resonator-integrated Guided-mode Resonance Filter with Reflection Phase Variation
|
2012 |
Inoue, Junichi |
A compound of RGB-splitter and condensers for compact image sensor
|
2012 |
Hirano, Tadayuki |
Compact multi-fiber receptacle interface for on-board optical interconnection
|
2012 |
Shikama, Kota |
Low Cost TSV Integration for Advanced Packaging Technologies
|
2012 |
Morikawa, Yasuhiro |
In-situ Observation of Whisker Nucleation in Air with AFM 179
|
2012 |
Onuki, Hiroshi |
Nondestructive defect analysis solution using combination of Lock-in IR Thermography and high resolution X-ray CT technology
|
2012 |
Seimiya, Naoki |
VLSI Nano-Scale Interconnect Induced Crosstalk Power Estimation
|
2012 |
Sevedolhosseini, Atefesadat |
Development of Human Body Communication Transceiver Based on Impulse Radio Scheme
|
2012 |
Shikada, Kageyuki |
Co-simulation of AC Power Noise of CMOS Microprocessor using Capacitor Charging Modeling
|
2012 |
Yoshikawa, Kumpei |
Macromodeling of Complex Power Delivery Networks for Efficient Transient Simulation
|
2012 |
Engin, A. Ege |
Development of a Novel Thermal Compression Flip Chip Bonding with Pre-Applied NCF Underfill
|
2012 |
Takeda, Kota |
Low Temperature Bonding Using Sub-micron Au Particles for Wafer-level MEMS Packaging
|
2012 |
Ito, Shin |
Thermal Stress and Die-Warpage Analyses of 3D Die Stacks on Organic Substrates
|
2012 |
Kohara, Sayuri |
Novel Compact Bandpass Filters for High-Density Packaging Applications
|
2012 |
Kushta, Taras |