IPACK2021-74116 Thermal Transport Across Al-(Alx Ga1-x)2O3 and Al-Ga2O3 Interfaces

IPACK2021-74116 Thermal Transport Across Al-(Alx Ga1-x)2O3 and Al-Ga2O3 Interfaces

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Veröffentlicht in:ASME International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online) Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
1. Verfasser: Shi, Jingjing (VerfasserIn)
Weitere Verfasser: Krishnan, Anusha (VerfasserIn), Bhuiyan, A. F. M. Anhar Uddin (VerfasserIn), Koh, Yee Rui (VerfasserIn), Huynh, Kenny (VerfasserIn), Mauze, Akhil (VerfasserIn), Mu, Sai (VerfasserIn), Foley, Brian M. (VerfasserIn), Ahmad, Habib (VerfasserIn), Itoh, Takeki (VerfasserIn), Zhang, Yuewei (VerfasserIn), Yuan, Chao (VerfasserIn), Kim, Samuel (VerfasserIn), Doolittle, W. Alan (VerfasserIn), Walle, Chris Van de (VerfasserIn), Speck, James S. (VerfasserIn), Goorsky, Mark (VerfasserIn), Hopkins, Patrick (VerfasserIn), Zhao, Hongping (VerfasserIn), Graham, Samuel (VerfasserIn)
Pages:2021
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
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