| Data Centers, Servers of the Future, Edge and Cloud Computing IPACK2021-66660 Electrical Performances of Package Layout for High Speed Networking and Cloud Computing Application
|
2021 |
Zhuang, Ming-Han |
| IPACK2021-73954 Optimizing Closed-Loop Liquid Cooling Solution for Extreme High Power Multi-Packages
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2021 |
Sahan,, Arunima Panigrahy, Prabhakar Subrahmanyam, Ying-Feng Pang, Ridvan |
| IPACK2021-74016 Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
|
2021 |
May, Chris |
| IPACK2021-74088 Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing
|
2021 |
Lall, Pradeep |
| IPACK2021-74570 Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
|
2021 |
Lall, Pradeep |
| IPACK2021-72726 Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
|
2021 |
Carlton, Hayden |
| IPACK2021-69321 Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics
|
2021 |
Olivera, Adrian |
| IPACK2021-69751 A Review on the Current Industrial Uses and the Future Outlook of Battery Thermal Management Systems for Electric Vehicles
|
2021 |
Choi, Nicholas |
| IPACK2021-73100 Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading
|
2021 |
Maniar, Youssef |
| IPACK2021-72293 Reliability of Electronic Drivers: An Industrial Approach
|
2021 |
Watté, P. |
| IPACK2021-69719 Mechanical Behavior of Heat Activated Film Adhesives
|
2021 |
Janamanchi, Prabhat |
| IPACK2021-74044 Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
|
2021 |
Hasan, S. M. Kamrul |
| IPACK2021-69317 Hotspot Cooling Performance for Submerged Confined Two-Phase Jet Impingement Cooling
|
2021 |
Chowdhury, Tanvir Ahmed |
| IPACK2021-72618 Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications
|
2021 |
Kim, John |
| IPACK2021-72621 Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
|
2021 |
Cataldo, Filippo |
| IPACK2021-72682 A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
|
2021 |
Peterson, Eric |
| IPACK2021-73271 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model
|
2021 |
Khalid, Rehan |
| IPACK2021-73270 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model
|
2021 |
Khalid, Rehan |
| IPACK2021-73269 Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model
|
2021 |
Khalid, Rehan |
| IPACK2021-73283 Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
|
2021 |
Kisitu, Deogratius |
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