| IPACK2021-67330 Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
|
2021 |
Unno, Noriyuki |
| IPACK2021-73314 Efficient Thermal Analysis of Lab-Grown Diamond Heat Spreaders
|
2021 |
Yuan, Zihao |
| IPACK2021-68121 An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems
|
2021 |
Korobko, Alexander V. |
| IPACK2021-69723 Design and Application of Innovative 3DVC in Al Server System
|
2021 |
Tan, Xianguang |
| IPACK2021-72612 Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
|
2021 |
Amalfi, Raffaele L. |
| IPACK2021-72620 Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data
|
2021 |
Haynau, Remy |
| IPACK2021-73253 BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
|
2021 |
Rao, Shreyas |
| IPACK2021-73313 Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
|
2021 |
Iradukunda, Ange-Christian |
| IPACK2021-73309 A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling
|
2021 |
Soroush, Farid |
| IPACK2021-69101 Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
|
2021 |
Fukue, Takashi |
| IPACK2021-69882 Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
|
2021 |
Fumikura,, Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya |
| IPACK2021-72975 Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
|
2021 |
Fukada, Masaya |
| IPACK2021-73197 Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
|
2021 |
Zhao, Beihan |
| IPACK2021-73334 Contact Angle Tuning of Copper Microporous Structures
|
2021 |
Soroush, Farid |
| IPACK2021-73548 Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys
|
2021 |
Hoque, Mohd Aminul |
| IPACK2021-73367 Reliable Additive Manufacturing Using Transient Liquid Phase Sintering
|
2021 |
Nave, Gilad |
| IPACK2021-74069 Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
|
2021 |
Lall, Pradeep |
| IPACK2021-74075 Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
|
2021 |
Lall, Pradeep |
| IPACK2021-75890 Reliability Evaluation of Cu-Al WB in High Temperature and High Current Applications
|
2021 |
Lall, Pradeep |
| IPACK2021-73648 Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation
|
2021 |
Meydando, Taher |
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