Site-specific Low Angle Plasma FIB Milling for Cross-sectional Electrical Characterization

Site-specific Low Angle Plasma FIB Milling for Cross-sectional Electrical Characterization

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Veröffentlicht in:International Symposium for Testing and Failure Analysis (45. : 2019 : Portland, Or.) ISTFA 2019
1. Verfasser: Zhang, Chuan (VerfasserIn)
Weitere Verfasser: Li, Jane Y. (VerfasserIn), Aguada, John (VerfasserIn), Marks, Howard (VerfasserIn)
Pages:2019
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Sprache:eng
Veröffentlicht: 2019
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