IPACK2018-8219 Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

IPACK2018-8219 Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

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Veröffentlicht in:ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2018 : San Francisco, Calif.) Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2018
1. Verfasser: Jaeger, Richard C. (VerfasserIn)
Weitere Verfasser: Chen, Jun (VerfasserIn), Suhling, Jeffrey C. (VerfasserIn), Fursin, Leonid (VerfasserIn)
Pages:2018
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2019
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