Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 11

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Bibliographische Detailangaben
Körperschaften: ECS Meeting (VerfasserIn), Electrochemical Society (Herausgebendes Organ), Electrochemical Society Dielectric Science and Technology Division (SponsorIn), Electrochemical Society Electronics and Photonics Division (SponsorIn)
Weitere Verfasser: Jagannathan, Hemanth (HerausgeberIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Pennington, NJ, USA ECS, the Electrochemical Society 2021
Red Hook, NY Curran Associates, Inc.
Schriftenreihe:ECS transactions General topics vol. 102, no. 2
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Titel Jahr Verfasser
Process-Induced ReRAM Performance Improvement of Atomic Layer Deposited HfO2 for Analog In-Memory Computing Applications 2021 Consiglio, S.
Study on Hydrogen-Based Reactive Ion Etching of Ovonic Threshold Switch (OTS) Materials for Phase Change Memory Devices 2021 Gill, D. S. Kim. Y. J.
Crystalline Oxide Semiconductor Applicable to Low-Power Consumption Edge AI 2021 Kunitake, H.
Performance Assessment of Amorphous HfO2-Based RRAM Devices for Neuromorphic Applications 2021 Ossorio, O. G.
Thermoelectrical Characterization of Piezoelectric Diaphragms: Towards a Better Understanding of Ferroelectrics for Future Memory Applications 2021 Vinuesa, G.
History of Micro-/Nano-Electronics Development; Breakthroughs and Innovations 2021 Iwai, H.
Characterization of Annealing and Dopant Activation Processes Using Differential Hall Effect Metrology (DHEM) 2021 Joshi, A.
Geometrical Layout Effect on Light Intensity Distribution in SSI-LED 2021 Kuo, A. Shukla. Y.
Influence of Amorphous-to-Crystalline Transformation on the Negative Thermo- Optic Properties of TiO2 Films 2021 Park, H.
Growth of High Sn Concentration Germanium-Tin Films on Insulators by Microsecond Laser Annealing 2021 Fukata:, R. Matsumura. N.
Epitaxial Growth of Highly Sb-Doped Ge on p-Ge (100) for Vertical Transistor Applications 2021 Saputro, R. H.
Effect of Inductively Coupled Electromagnetic Field on Bottom Oxide Etch in a High Aspect Ratio Trench 2021 Sardo, S.
Wrinkles Emerging in SiO2/Si Stack During UV Nanosecond Laser Anneal 2021 Karmous, I.
Layer Thickness Effect on Lifetime of Copper Oxide Passivated Plasma Etched Copper Line 2021 Su, J. O.
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