| Miniaturized LTE Modem SiP Using Novel Multiple Compartments Shielding
|
2014 |
Leou, JL |
| (Invited) Over-1000-channel Hybrid Integrated Light Source with Laser Diode Arrays on a Silicon Waveguide Platform for Ultra-high-bandwidth Optical Interconnections
|
2014 |
Shimizu, Takanori |
| Development of Combined Surface Activated Bonding (SAB) Method for Hydrophilic Wafer Bonding
|
2014 |
He, Ran |
| On-board Snubber Circuit for Damping of Anti-resonance Peak in Total PDN
|
2014 |
Yamaguchi, Toma |
| Loss Analysis for Optical MCM Based Optical Link
|
2014 |
Hsu, Hsiang-Han |
| 3.3-Tb/s compact optical fiber package using pre-formed optical fiber
|
2014 |
Nomura, Rika |
| Photosensitive Insulation Coating for a Copper Redistribution Layer Process
|
2014 |
Matsutani, Hiroshi |
| A Feasibility Study of Novel Packaging Technology for Low Cost and High Performance Systems .
|
2014 |
Iguchi, Daisuke |
| 1060-nm VCSEL-based 28-Gb/s x 4-channnel optical signal transmission beyond 500-m MMF using high-density parallel-optical modules
|
2014 |
Ishikawa, Kazuya Nagashima, Tomofumi Kise, Yozo |
| Influence of packaging on frequency drift in MEMS resonators - Dynamic effect of packaging on MEMS device performance -
|
2014 |
Nishida, Takuma |
| Optimizing FCCSP Design with Cu-pillar Bump in High Sensitivity Fingerprint Sensor
|
2014 |
Huang, Chih-Yi |
| Fabrication and Electrical Characterization of Parylene-HT Liner Bottom-up Copper Filled Through Silicon Via (TSV)
|
2014 |
Tung, Bui Thanh |
| Fabrication for Low-Loss Polymer Optical Waveguides with 90° Bending Using the Mosquito Method
|
2014 |
Takahashi, Asami |
| Design for PMT connector (Polymer waveguides connected with MT connector)
|
2014 |
Takezaki, Motohito |
| Fabrication of Flexible Thermoelectric Thin Film Module using Micro Porous Structure
|
2014 |
Kato, Kunihisa |
| Low Power Penalty, Dry-Film Polymer Waveguides for Silicon Photonics Chip Packaging
|
2014 |
Hsu, Hsiang-Han |
| Silica Nanowires as New Coating Material for High-efficiency Light Reflection in LED System
|
2014 |
Xi, Shuang |
| High Speed LCP Board for 28Gbps Transmission through 300mm
|
2014 |
Kataoka, Ryohei |
| Simulation of Differential Skew Considering Fiber Kink Effects
|
2014 |
Fukumori, Taiga |
| Precision Assembly of Polymer Waveguide Components for Silicon Photonic Packaging
|
2014 |
Taira, Yoichi |
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