Nondestructive defect analysis solution using combination of Lock-in IR Thermography and high resolution X-ray CT technology

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:2012 2nd IEEE CPMT Symposium Japan
1. Verfasser: Seimiya, Naoki (VerfasserIn)
Pages:2012 2
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2012
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
High-stability 25 Gb/s optical transceiver module with flexible polymer wave guide for optical interconnection 2012 Matsushima, Naoki
A 25-Gbit/s High-speed Optical-electrical printed Circuit Board for Chip-to-chip Optical Interconnections 2012 Matsuoka, Yasunobu
(Invited) Graded-Index Core Polymer Optical Waveguide for High-Speed and High-Density On-Board Interconnects 2012 Ishigure, Takaaki
Room Temperature Microjoining of qVGA Class Area-Bump Array Using Cone Bump 2012 Shuto, Takanori
Cu wire bonding knows no limit - 28 nm is qualified Bernd K Appelt 2012 Appelt, Bernd K.
Impact Test Performance of Zn-based Die-attach Joints for Power Devices 2012 Song, Jenn-Ming
(Invited) JCAP Technology Introduction 2012 Tan, Kim-Hwee
(Invited) Fast Life-time Assessment of LED Luminaries 2012 Yang, Daoguo
Sn-Ag-Cu-solder-reflow-capable 10-Gb/s x 4-channel very thin high-density parallel-optical modules 2012 Nagashima, Kazuya
Effects of GaN Blue LED Chips and Phosphors on Optical Performance of White Light LED 2012 Zhao, Huishan
Wide Bus Chip-to-Chip Interconnection Technology Using Fine Pitch Bump Joint Array for 3D LSI Chip Stacking 2012 Aoyagi, Masahiro
Investigation of Fracture Behaviors of Cu-Sn Intermetallics using Impact Test 2012 Yang, Chaoran
Development of DAF (Die Attach Film) with functional gettering agent for metal impurities 2012 Takyu, Shinya
Surface Characterization of Resilience Sheet as a Packaging Material for the Metallic Ink Printing 2012 Yasuda, Kiyokazu
Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing 2012 Kim, Youngseok
Novel EMI Shielding Methodology on Highly Integration SiP Module 2012 Kuo-Hsien, Liao
Proposal and analysis of three-phase filter by using mixed-mode S-parameter based on Fortescue transformation 2012 Fujishiro, Yoshikazu
Measurement Results of Substrate Bias Dependency on Negative Bias Temperature Instability Degradation ina 65 nm Process 2012 Tanihiro, Syuichi
A Signal and Power Integrity Oriented Packaging for Low Cost and High Performance Systems 2012 Iguchi, Daisuke
Using Nano-Porous Au-Ag Sheets as a Joint Layer for Low-Temperature Au-Au Bonding 2012 Mimatsu, Hayata
Alle Artikel auflisten