(Invited) 3D Packaging Trend - TSV or TMV?

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Bibliographische Detailangaben
Veröffentlicht in:2012 2nd IEEE CPMT Symposium Japan
1. Verfasser: Yoshida, Akito (VerfasserIn)
Pages:2012 2
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2012
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Titel Jahr Verfasser
Productivity Improvement of Copper Pillar Flip-chip Package by Pre-applied Materials and Press Machine 2012 Motomura, Koji
High Density Package Solutions for Next-Generation Smartphone, Ultrabook and Tablet Computing 2012 Solberg, Vern
Novel DAF (Die Attach Film) separation technologies for ultra-thin chip 2012 Takyu, Shinya
Thin Packaging - What is Next? 2012 Appelt, Bernd K.
Electrical Properties of Flexible Vertically aligned Carbon Nanotube Bumps under Compression 2012 Fujino, Masahisa
(Invited) Next Generation Optical Interconnect Devices Using Photonic Polymers 2012 Sugihara, Okihiro
Cavity-resonator-integrated Guided-mode Resonance Filter with Reflection Phase Variation 2012 Inoue, Junichi
A compound of RGB-splitter and condensers for compact image sensor 2012 Hirano, Tadayuki
Compact multi-fiber receptacle interface for on-board optical interconnection 2012 Shikama, Kota
Low Cost TSV Integration for Advanced Packaging Technologies 2012 Morikawa, Yasuhiro
In-situ Observation of Whisker Nucleation in Air with AFM 179 2012 Onuki, Hiroshi
Nondestructive defect analysis solution using combination of Lock-in IR Thermography and high resolution X-ray CT technology 2012 Seimiya, Naoki
VLSI Nano-Scale Interconnect Induced Crosstalk Power Estimation 2012 Sevedolhosseini, Atefesadat
Development of Human Body Communication Transceiver Based on Impulse Radio Scheme 2012 Shikada, Kageyuki
Co-simulation of AC Power Noise of CMOS Microprocessor using Capacitor Charging Modeling 2012 Yoshikawa, Kumpei
Macromodeling of Complex Power Delivery Networks for Efficient Transient Simulation 2012 Engin, A. Ege
Development of a Novel Thermal Compression Flip Chip Bonding with Pre-Applied NCF Underfill 2012 Takeda, Kota
Low Temperature Bonding Using Sub-micron Au Particles for Wafer-level MEMS Packaging 2012 Ito, Shin
Thermal Stress and Die-Warpage Analyses of 3D Die Stacks on Organic Substrates 2012 Kohara, Sayuri
Novel Compact Bandpass Filters for High-Density Packaging Applications 2012 Kushta, Taras
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