Effect of Mild Aging on Package Drop Performance for Lead Free Solders

Effect of Mild Aging on Package Drop Performance for Lead Free Solders

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:2010 IEEE CPMT Symposium Japan
1. Verfasser: Na, SeokHo (VerfasserIn)
Weitere Verfasser: Cha, SeWoong (VerfasserIn), Kang, WonJoon (VerfasserIn), Kim, TaeSeong (VerfasserIn), Hwang, TaeKyung (VerfasserIn), Khim, JinYoung (VerfasserIn)
Pages:2010
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2010
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
Module Miniaturization by ultra thin Package Stacking 2010 Löher, Thomas
Alternative Process and Support Material for Embedded Fine-pad-pitch LSI Package 2010 Murai, Hideya
Modeling of Board Level Solder Joint Reliability under Mechanical Drop Test with the Consideration of Plastic Strain Hardening of Lead-free Solder 2010 Xu, Z. J.
Fast Power Integrity Estimation Method by Use of LSI Power-pin Model 2010 Harada, Takashi
Design Trade-Off for Resonance Reduction of Multiple Power Planes in Super Ball Grid Array (SBGA) Package 2010 Kim, GaWon
TSV Mutual Inductance Effect on Impedance of 3D Stacked On-Chip PDN with Multi-TSV Connections 2010 Pak, Jun So
Impulse Responses of On-chip Power Supply Networks with Varying Conditions 2010 Uematsu, Yutaka
Study on Novel Concept of Transmission Signal Assisted with Evanescent Wave Energy 2010 Hashimoto, Kaoru
Review on the High Temperature Warpage Measurement Using Shadow Moiré 2010 Um, Yong Goo
Vibration Test Durability on Large BGA Assemblies: Evaluation of Reinforcement Techniques 2010 Berthou3, Matthieu
Study on the Application of Thermal Interface Materials for Integration of HP-LEDs 2010 Wu, Jun
Invited : Multichannel Optical Modules with an SF Optical Connector Interface 2010 Tanobe, Hiromasa
4-ch x 10-Gb/s Chip-to-chip Optical Interconnections with Optoelectronic Packages and Optical Waveguide Separated from PCB 2010 Takagi, Yutaka
Relationship Between Alignment Errors of Optical Components and Power Consumption in Ptoelectronic Devices 2010 Morita, Hironobu
Optical Waveguide Materials with High Thermal Reliability and Their Applications for High-density Optical Interconnections 2010 Shibata, Tomoaki
Silicon TSV Interposer with Embedded Capacitors for High Performance VLSI Packaging 2010 Vodrahall, Nagesh
High Density Substrate Solution for Complex High Pin Count Flip-Chip Applications 2010 Solberg, Vern
Effect of Solders, Underfills and Substrates on Reliability of Flip-Chip Bonding of Low-k Semiconductor Chips 2010 Terada, Kenji
Effects of the Crystallographic Orientation of Sn Grain During Electromigration Test 2010 Lee, Kiju
Through Co-Design to Optimize Power Delivery Distribution System Using Embedded Discrete Decoupling Capacitor 2010 Wang, Chen-Chao
Alle Artikel auflisten