Advances in hygrothermal performance of building envelopes materials, systems and simulations

Gespeichert in:
Bibliographische Detailangaben
Körperschaften: Symposium on Advances in Hygrothermal Performance of Building Envelopes: Materials, Systems and Simulations (VerfasserIn), ASTM International Committee C16 on Thermal Insulation (SponsorIn)
Weitere Verfasser: Mukhopadhyaya, Phalguni (HerausgeberIn), Fisler, Diana (HerausgeberIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: West Conshohocken, PA ASTM International 2017
Schriftenreihe:Selected technical papers / ASTM International STP 1599
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Beschreibung:"... contains peer-reviewed papers ... presented at a symposium held October 26-27, 2016, in Orlando, Florida, USA. The workshop was sponsored by ASTM International Committee C16 on Thermal Insulation and Subcommittee C16.33 on Insulation Finishes and Moisture" - Vorwort
"The Symposium on Advances in Hygrothermal Performance of Building Envelopes: Materials, Systems and Simulations was held on October 26 and 27, 2016, at the Renaissance Orlando at SeaWorld in Orlando, FL, USA" - Seite vii
"ASTM Symposium on Advances in Hygrothermal Performance of Building Envelopes: Materials, Systems and Simulations on October 26-27, 2016 in Orlando, FL" - Fußnote auf der jeweils ersten Seite der Beiträge
Includes bibliographical references
Beschreibung:viii, 394 Seiten
Illustrationen
23 cm
ISBN:9780803176478
978-0-8031-7647-8