Processing materials of 3D interconnects, damascene, and electronics packaging 6 : [papers ... originally presented in the Symposium "Processing Materials of 3D Interconnects, Damascene and Electronics Packaging", held during the 226th meeting of the Electrochemical Society, in Cancun, Mexico, October 5 to October 9, 2014, ... a joint international meeting with the Sociedad Mexicana de Electroquímica]

Processing materials of 3D interconnects, damascene, and electronics packaging 6 [papers ... originally presented in the Symposium "Processing Materials of 3D Interconnects, Damascene and Electronics Packaging", held during the 226th meeting of the Electrochemical Society, in Cancun, Mexico, October 5 to October 9, 2014, ... a joint international meeting with the Sociedad Mexicana de Electroquímica]

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Bibliographische Detailangaben
Körperschaften: Sociedad Mexicana de Electroquímica (BerichterstatterIn), Electrochemical Society Electronics and Photonics Division (BerichterstatterIn)
Weitere Verfasser: Kondo, K. (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Pennington, NJ Electrochemical Soc. 2015
Schriftenreihe:ECS transactions Electronic materials and processing 64,40
Schlagworte:
Konferenzschrift
Online Zugang:Inhaltsverzeichnis
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Beschreibung
Beschreibung:Literaturangaben
Beschreibung:VI, 132 S.
Ill., graph. Darst.
ISBN:9781623322632
978-1-62332-263-2