Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 2013 presented at ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, July 16 - 18, 2013, Burlingame, California, USA Vol. 1 Advanced packaging - emerging technologies - modeling and simulation - multi-physics based reliability - MEMS and NEMS - materials and processes

Bibliographische Detailangaben

Körperschaft:	American Society of Mechanical Engineers Electronic and Photonic Packaging Division (BerichterstatterIn)
Weitere Verfasser:	Sammakia, Bahgat (BerichterstatterIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	New York, NY ASME 2014
Schlagworte:
Online Zugang:	Inhaltsverzeichnis
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