Mechanismen und Größeneffekte von Ermüdungsschädigungen in dünnen Kupferfilmen bei sehr hohen Zyklenzahlen
Göttingen, Univ., Diss., 2013
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2013
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Tag hinzufügen | Zusammenfassung: | Göttingen, Univ., Diss., 2013 Thin metal films show completely different fatigue behavior than bulk metals. The films have longer fatigue lives and instead of extrusions and complex dislocation structures, they form interface cracks and isolated dislocations during fatigue. These observations indicate a reduction in accumulated plastic strain in the films, which is likely a manifestation of their increased strength. In order to investigate thin film fatigue under conditions comparable to those present in sensors and microelectronic devices, very-high cycle fatigue behavior of supported Cu films with thicknesses between ... |
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| Beschreibung: | xi, 140 S. |