Proceedings of the ASME Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS - 2011 presented at ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS, July 6 - 8, 2011, Portland, Oregon, USA Vol. 1 Advanced packaging, modeling and simulation, MEMS, NEMS, multi physics based reliability, electrical, emerging technologies

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Bibliographische Detailangaben
Körperschaft: American Society of Mechanical Engineers Electronic and Photonic Packaging Division (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: New York, NY ASME 2012
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Beschreibung:XVI, 785 S.
ISBN:9780791844618
978-0-7918-4461-8