Electronics packaging 3 : at the 214th ECS meeting ; October 12 - 17, 2008, Honolulu, Hawai, USA ; [papers ... presented in the Symposium "Electronics Packaging 3", held during the PRiME 2008 joint international meeting of the Electrochemical Society and the Electrochemical Society of Japan]

Electronics packaging 3 at the 214th ECS meeting ; October 12 - 17, 2008, Honolulu, Hawai, USA ; [papers ... presented in the Symposium "Electronics Packaging 3", held during the PRiME 2008 joint international meeting of the Electrochemical Society and the Electrochemical Society of Japan]

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Bibliographische Detailangaben
Körperschaft: Electrochemical Society Electrodeposition Division (BerichterstatterIn)
Weitere Verfasser: Hayase, M. (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Red Hook, NY Curran 2009
Schriftenreihe:ECS transactions 16,22
Schlagworte:
Konferenzschrift
Online Zugang:Inhaltsverzeichnis
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Beschreibung:111 S.
ISBN:9781615672967
978-1-61567-296-7