An experimental validation of modelling for lead-free solder joint reliability

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:National Physical Laboratory (Teddington) NPL electronics interconnection reports on CD
Weitere Verfasser: Dusek, M. (BerichterstatterIn)
Format: UnknownFormat
Veröffentlicht: 2001
Schriftenreihe:NPL report MATC (A) 11
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
A test procedure for measurement of solder volume effect on reliability 2002 Dusek, M.
Rework of mixed lead-free alloys : a guide 2002 Wickham, M.
Rheology testing of solder pastes and conductive adhesives : a guide 2002 Dusek, M.
Reliablity of joints formed with mixed alloy solders 2002
Test methods for evaluating the reliability of pcb finishes using lead-free alloys : a guide 2002 Dusek, M.
A review of electronics materials deposition techniques including solder jetting and relief printing 2002
Test method for dispensing electronic process materials 2002 Brewin, A.
Rheology testing of solder pastes and conductive adhesives used in stencil printing 2002 Dusek, M.
Design guidelines for ultra fine pitch solder paste printing 2002
Creep properties of SnAgCi solder in surface mount assemblies 2001 Nottay, J.
Development of surface insulation resistance measurements for electronic assemblies 2001 Hunt, C. P.
Predicting microstructure of mixed solder alloy systems 2001
Test method for the measurement of tensile and shear tack for electronic solder pastes and adhesives 2001 Brewin, A.
Technology mission to assess the status of lead-free soldering in Japan 2001 Hunt, C. P.
A review of mechanical test method standards for lead-free solders 2001 Wickham, M.
Reworking solder alloy mixtures of lead-free and tin-lead alloys 2001
Compatibility of lead-free solders with pcb materials 2001 Dusek, M.
A novel measurement technique for stencil printed solder paste 2001 Dusek, M.
Fine pitch stencil printing using enclosed pronting systems 2001 Wickham, M.
The effect of solder alloy, metal particle size and substrate resist on fine pitch stencil printing performance 2001
Alle Artikel auflisten