Chemical mechanical planarization VI proceedings of the international symposium ; [proceedings of the 6th International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 204th meeting of the Electrochemical Society, in Orlando, Floruda from October 12th to 17th, 2003]

Bibliographische Detailangaben

Körperschaften:	Electrochemical Society Electronics Division (BerichterstatterIn), International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (BerichterstatterIn)
Weitere Verfasser:	Seal, Sudipta (BerichterstatterIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	Pennington, NJ Electrochemical Society 2003
Schriftenreihe:	Proceedings volume / Electrochemical Society 2003-21
Schlagworte:	Microelectronics > Materials > Grinding and polishing > Metals > Pickling > Integrated circuits > Chemical mechanical planarization > Konferenzschrift
Online Zugang:	Table of contents
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