Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology - 2003 : presented at the 2003 ASME International Mechanical Engineering Congress, November 15 - 21, 2003, Washington, D.C.

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology - 2003 presented at the 2003 ASME International Mechanical Engineering Congress, November 15 - 21, 2003, Washington, D.C.

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Bibliographische Detailangaben
Körperschaft: International Mechanical Engineering Congress (BerichterstatterIn)
Weitere Verfasser: Lee, Ricky (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: New York, NY American Society of Mechanical Engineers 2003
Schriftenreihe:EPP 3
Schlagworte:
Electronic packaging > Congresses > Photonics > Nanotechnology > Microelectronic packaging > Surface mount technology > Microelectromechanical systems > Integrated circuits > Konferenzschrift
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Beschreibung
Beschreibung:XI, 893 S
ISBN:0791837149
0-7918-3714-9