Thin film materials, processes, and reliability : proceedings of the international symposia ; [contains the papers from two sub-symposia on thin film materials, processes, and reliability: part I - patterning of low- and high-k films and damage control in ULSI device fabrication and part II - copper interconnect & low-k interlevel dielectric films in ULSI circuits, held as part of the 2001 joint internation meeting - the 200th meeting of the Electrochemical Society and the 52nd annual meeting of the International Society of Electrochemistry, in San Francisco, CA, September 2 - 7, 2001]

Thin film materials, processes, and reliability proceedings of the international symposia ; [contains the papers from two sub-symposia on thin film materials, processes, and reliability: part I - patterning of low- and high-k films and damage control in ULSI device fabrication and part II - copper interconnect & low-k interlevel dielectric films in ULSI circuits, held as part of the 2001 joint internation meeting - the 200th meeting of the Electrochemical Society and the 52nd annual meeting of the International Society of Electrochemistry, in San Francisco, CA, September 2 - 7, 2001]

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Bibliographische Detailangaben
Körperschaft: International Society of Electrochemistry (BerichterstatterIn)
Weitere Verfasser: Mathad, G. S. (BerichterstatterIn)
Format: UnknownFormat
Sprache:eng
Veröffentlicht: Pennington, NJ Electrochemical Society 2001
Schriftenreihe:Proceedings volume / Electrochemical Society 2001-24
Schlagworte:
Thin film devices > Design and construction > Thin films > Congresses > Konferenzschrift
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Beschreibung
Beschreibung:VIII, 216 S
ISBN:1566773571
1-56677-357-1