OPTIMIZING DEVICE, PACKAGING, TEST: THE ART OF FAST TRACKING A DESIGN TO PRODUCTION

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Bibliographische Detailangaben
Veröffentlicht in:	Annual MEPTEC MEMS Technology Symposium (14. : 2016 : San Jose, Calif.) Advancing MEMS and sensors for today's exploding demands
1. Verfasser:	Apanius, M. (VerfasserIn)
Format:	UnknownFormat
Sprache:	eng
Veröffentlicht:	2020
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Titel	Jahr	Verfasser
YOU SAY TOMATOES, I SAY SENSORS	2020	O'Reilly, R.
FAN-OUT WAFTER LEVEL PACKAGING ENABLES MEMS AND SENSORS TO MEET FURTURE IOT REQUIREMENTS	2020	Jamshidi, B.
HIGH VOLUME MEMS TESTING EVOLUTION, CHALLENGES AND THE FUTURE	2020	Vranes, M.
FROM STANDARD MEMS PROCESSES (MUMPS®) TO COMMERCIAL SUCCESS	2020	Cowen, A.
STANDARDIZATION OF PACKAGING FOR THE INTERNET OF THINGS	2020	Arcedera, A.
BUILDING THE FUTURE: NEXTFLEX'S COLLABORATIVE ENVIRONMENT TO ADVANCE THE FLEXIBLE HYBRID ELECTRONICS ECOSYSTEM	2020	Thompson, M.
OPTIMIZING DEVICE, PACKAGING, TEST: THE ART OF FAST TRACKING A DESIGN TO PRODUCTION	2020	Apanius, M.
SENSING SYSTEM SYNBIOSIS	2020	Hartwell, P.
LEVERAGING HIGH SPEED CONTINUOUS MANUFACTURING ELECTRONICS PACKAGING	2020	Panda, A.
TESTING APPROACHES FOR CHARACTERIZATION AND SELECTION OF MEMS INTERTIAL SENSORS	2020	Smajlovic, D.
ADVANCED WLP PLATFORM FOR HIGH-PERFORMANCE MEMS	2020	Spicer, D.
ENDPOINT SECURITY IN IOT, FROM THE PERSPECTIVE OF END-TO-END SECURITY	2020	Bonomi, F.