Near-Threshold Fatigue Crack Growth Behavior of ECAPed Ultrafine-Grained Copper

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Veröffentlicht in:International Conference on Processing and Manufacturing of Advanced Materials: Processing, Fabrication, Properties, Applications (11. : 2021 : Wien) THERMEC 2021 ; Part 2
1. Verfasser: Qu, S. D. (VerfasserIn)
Weitere Verfasser: YOU, Z. S. (VerfasserIn)
Pages:2021
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2021
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