SLIR 751: A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and Lead-Free Assemblies

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:SMTA International Conference (2021 : Minneapolis, Minn.; Online) 2021 SMTA International Conference ; Volume 2 of 2
1. Verfasser: Clech, Jean-Paul (VerfasserIn)
Pages:2021
Format: UnknownFormat
Sprache:eng
Veröffentlicht: 2022
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Titel Jahr Verfasser
LTS 572: Solder Ball Drift Behavior of Hybrid SnAgCu-LTS Solder Interconnects in Accelerated Thermal Cycling 2022 Wentlent, Luke
MFX 650: The Evolution of Material Handling Practices and Processes 2022 Adamson, Michael
MFX 658: Statistical Analysis of Transfer Efficiency in the Age of Very Large Sample Sizes 2022 Lasky, Ron
MFX 664: Designing of Rheology Tests to Develop New Solder Pastes Formulations 2022 Morin, Charlotte
MFX 665: The Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 Passives 2022 Patra, Swagatika
MFX 667: Detailed Study of Condensate Residues in the Soldering Process - Analysis of the Responsible Reaction Partners as Well as Reasons for Condensate Polymerization and Growth of Crystalline Structures 2022 Rawinski, Viktoria
MFX 672: New Device Validates Printer Accuracy and Squeegee Force Capability During Singular Test 2022 Sivigny, Michael
SUB 852: Improving Immersion Silver Performance for 5G Applications 2022 Stafstrom, Eric
TI 952: The Effects of the Cleaning of Populated Circuits Boards on the Performance of Conformal Coating in Thermal Shock Testing 2022 Brightwell, Chris
SUB 854: Varying Requirements, Same Inkjet Solder Mask Coating Tool: The Case of Inkjet Adaptability by Printing Strategies 2022 Grand, Bas Le
TI 951: Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys 2022 Rawson, Tan
TI 957: An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-WorkApplications 2022 Jenkins, Dan
TI 956: An Automated PCB Design Constraint Extraction and Verification from the SOC Platform Design Collateral 2022 Hatfield, Alan
TI 958: High Performance Liquid Metal Thermal Interface Materials 2022 Lasky, Ron
TI 955: Aerosol Jet Printed Interconnects for Millimeter-Wave Components 2022 Hamre, John
MFX 652: Site-Specific Ionic Contamination Process Control Monitoring Plan Method 2022 Bixenman, Mike
MFX 653: Identifying Cleaning Compatibility Issues with Electronic Components 2022 Brennan, Claire
MFX 656: Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration 2022 Griffith, Evan
MFX 651: Process and Design Guidelines for Large and Complex RF and EMI Shields for Board Level Assemmbly 2022 Alam, Mohammed
MFX 660: Cleanliness Detection and Resistance of Solvent Extract - A Critical Evaluation 2022 Lober, David
Alle Artikel auflisten